The Noctua NT-H2 3.5g is a professional-grade thermal compound designed for elite system builders, overclockers, and silence enthusiasts. Building upon the success of the award-winning NT-H1, the NT-H2 combines even lower thermal resistance with improved particle composition, ensuring optimal contact under high pressure for superior heat transfer. Ideal for air and liquid coolers alike.

Key Features:

Next-generation hybrid compound for high-performance CPU/GPU thermal interfaces

Improved thermal conductivity with reduced particle-to-particle resistance

Non-conductive, non-corrosive, and safe for all types of coolers and sockets

Easy to spread and clean—no curing time required

3.5g volume supports approximately 3–20 applications depending on CPU size

Specifications:

• Volume: 3.5g

• Color: Grey

• Density: 2.81 g/cm³

• Operating Temperature: -50°C to +200°C

• Thermal Conductivity: Excellent (exact µ-value not disclosed by Noctua)

• Electrically Conductive: No

• Requires Curing Time: No

• Application Lifespan: Up to 5 years on CPU

• Storage Lifespan: Up to 3 years unopened

Additional Features:

• Optimized for high-pressure mounting systems like SecuFirm2™

• Ideal for both overclocked and silent running configurations

• Works on CPUs, GPUs, and bare-die applications

• Includes cleaning wipes in larger kits (not included in this 3.5g edition)

Customer Benefits:
The NT-H2 ensures consistent cooling performance across the most demanding platforms. It’s easy to work with, highly stable over time, and provides a noticeable edge in thermal regulation for both novice builders and professional modders.

What’s in the Box:

• 1 × 3.5g NT-H2 thermal compound syringe

• Instructions for application (multi-language)

Compliance:
Meets CE, RoHS, and REACH regulations. Tested for chemical stability, electrical insulation, and long-term safety on all major hardware surfaces.

Manufacturer Contact:
Company Name: Noctua GmbH
Address: Josef-Preis-Allee 18, 8020 Graz, Austria
Email: support(at)noctua(dot)at